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Good plating stability and wide brightness range; The tin-lead ratio of the coating is adjustable, which meets the requirements of different tin-lead ratios (60/40; 90/10), low carbon content (0.2%), and good solderability.
Fluorine-free for bump plating.
| Methanesulfonic acid | 110～150 ml/L |
| Stannous methanesulfonate | 45～65 ml/L |
| Lead(II) methanesulfonate | 4～20 ml/L |
LD-7740A | 40～50 ml/L |
| LD-7740B | 8～12 ml/L |
